Advanced Eutectic Mounting System for Efficient Manufacturing Solutions

• Overview
• Product Description
• Application
• Exhibition & Customers
• Packaging & Shipping
• FAQ

Overview

Basic Info.

Product Name	Automatic Eutectic Mounter
Feature	High Speed and Precision
Certification	ISO
Condition	New
Transport Package	Customized or Wooden Box Packaging
Specification	Standard Specifications
Trademark	Himalaya
Origin	China

Product Description

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers! Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Q1:How to choose a suitable machine? A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment? A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.

Product Description

This device is specifically designed for fully automatic eutectic mounting of TO (transistor shaped) laser devices. Starting from the loading of TO tube shells, the production process of TO device heat sink and LD chip mounting is completed through wafer loading, precision platform calibration, SUB (heat sink) eutectic mounting, LD (laser diode) chip eutectic mounting, and finished product cutting in an assembly line manner. This device has the characteristics of high speed and precision, achieving complex timing and rigorous logic in the process. The equipment adopts structures such as cam drive, linkage between connecting rods, precision fixtures, etc., combined with multi axis motion control, visual positioning and other technologies, and has the ability to produce in bulk.

Application Exhibition & Customers Packaging & Shipping FAQ